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MKP3V120, MKP3V240
Sidac High Voltage
Bidirectional Triggers
Bidirectional devices designed for direct interface with the AC
power line. Upon reaching the breakover voltage in each direction, the
device switches from a blocking state to a low voltage on ? state.
Conduction will continue like a Triac until the main terminal current
drops below the holding current. The plastic axial lead package
provides high pulse current capability at low cost. Glass passivation
insures reliable operation.
Features
? High Pressure Sodium Vapor Lighting
? Strobes and Flashers
? Ignitors
? High Voltage Regulators
? Pulse Generators
? Used to Trigger Gates of SCR’s and Triacs
? Indicates UL Registered ? File #E210057
? These are Pb ? Free Devices*
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
http://onsemi.com
SIDACS ( )
1 AMPERE RMS
120 and 240 VOLTS
MT1 MT2
MARKING DIAGRAM
AXIAL LEAD
(No Polarity)
CASE 267
STYLE 2
Rating
Peak Repetitive Off ? State Voltage
(Sine Wave, 50 to 60 Hz, T J = ? 40 to 125 ° C)
MKP3V120
MKP3V240
On-State RMS Current (T L = 80 ° C, Lead
Length = 3/8 ″ , All Conduction Angles)
Peak Non ? Repetitive Surge Current
(60 Hz One Cycle Sine Wave, Peak Value,
T J = 125 ° C)
Operating Junction Temperature Range
Storage Temperature Range
THERMAL CHARACTERISTICS
Symbol
V DRM ,
V RRM
I T(RMS)
I TSM
T J
T stg
Value
" 90
" 180
" 1.0
" 20
? 40 to +125
? 40 to +150
Unit
V
A
A
° C
° C
A
MKP
3Vxx0
YYWW G
G
A = Assembly Location
xx = 12 or 24
YY, Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
Characteristic
Thermal Resistance, Junction ? to ? Lead
(Lead Length = 3/8 ″ )
Lead Solder Temperature
(Lead Length w 1/16 ″ from Case, 10 s Max)
Symbol
R q JL
T L
Max
15
260
Unit
° C/W
° C
MKP3V120G
MKP3V120RLG
MKP3V240G
MKP3V240RLG
Axial Lead*
Axial Lead*
Axial Lead*
Axial Lead*
500 Units/Box
1500/Tape & Reel
500 Units/Box
1500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
June, 2012 ? Rev. 6
1
Publication Order Number:
MKP3V120/D
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